Test Sample 1: Silver Inov. Detects Ring Patter

Test Sample 2: 10 mm Bond Void Detected

Process variation revealed and comparing area of the wafer shows variations

Test Sample 3: Capping Correct Greater than 400 um thickness variation in profile

Test Sample 4: Capping the thickness variations that show process defect

Test Sample 5: Capping the process variation that impacts measured thickness

Test Sample 5: Capping greater than 200 um thickness variation in profile